The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
May. 22, 2018
Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;
Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;
Fu Cheng Chen, Shanghai, CN;
Jian Gang Lu, Shanghai, CN;
Abstract
A semiconductor structure includes providing a substrate including a first surface and a second surface opposite to the first surface. The first surface is a functional surface. The method also includes forming a plastic seal layer on the first surface of the substrate, and performing a thinning-down process on the second surface of the substrate after forming the plastic seal layer. The plastic seal layer provides support for the substrate during the thinning-down process, and thus warping or cracking of the plastic seal layermay be avoided. In addition, the plastic seal layer can also be used as a material for packaging the substrate. Therefore, after the thinning-down process, the plastic seal layer does not need to be removed. As such, the fabrication process is simplified, and the production cost is reduced.