Fu Cheng Chen

Title: Fu Cheng Chen: Innovator in Packaging and Image Sensor Technologies

Introduction

Fu Cheng Chen is a prominent inventor based in Shanghai, China. He has made significant contributions to the fields of packaging structures and image sensor technologies. With a total of 6 patents to his name, Chen continues to push the boundaries of innovation in his field.

Latest Patents

Among his latest patents is a novel packaging structure that includes a plurality of first chips and a molding layer positioned between adjacent first chips. This molding layer covers the sidewall of the first chip while exposing its top surface. Another notable patent is for an image sensor with metal grids, which outlines a method for manufacturing the sensor. This method involves providing a substrate structure, forming a mask layer with openings, depositing a metal grid material, and stripping the mask layer to remove excess material. The substrate structure is designed with a first surface, multiple pixels, isolation structures, and an anti-reflective coating.

Career Highlights

Fu Cheng Chen has worked with leading companies in the semiconductor industry, including Semiconductor Manufacturing International (Shanghai) Corporation and Semiconductor Manufacturing International (Beijing) Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies.

Collaborations

Throughout his career, Chen has collaborated with notable colleagues such as Jian Lu and De Kui Qi. These partnerships have fostered an environment of innovation and creativity, leading to the development of advanced technologies.

Conclusion

Fu Cheng Chen is a distinguished inventor whose work in packaging structures and image sensors has made a significant impact in the technology sector. His innovative spirit and dedication to research continue to inspire future advancements in the field.