Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Tyco Electronics Corporation

Tyco Electronics (shanghai) Co., Ltd.

Nuvolta Technologies (hefei) Co., Ltd.

Espressif Systems (shanghai) Co., Ltd.

Jian Lu

Fu Cheng Chen

David Bruce Sarraf

Zeng Li

Eric David Briant

Jinbiao Huang

Hao Lin

Jiangjian Jiang

Swee Ann Teo

Zhijun Luo

Honghao Wu

Zhaohai Xue

Lucas A Benson

An apparatus includes a rectifier coupled to a receiver coil, the receiver coil configured to be magnetically coupled to a transmitter coil of a wireless power transfer system, wherein the rectifier is configured to convert an alternating current voltage into a direct current voltage, a first communication apparatus configured to provide a low speed communication to a transmitter of the wireless power transfer system, and a second communication apparatus configured to provide a high-speed communication to the transmitter of the wireless power transfer system, wherein the high-speed communication provided by the second communication apparatus is enabled through the low speed communication provided by the first communication apparatus.

Wireless power communication apparatus and method

A packaging structure is provided. The packaging structure includes a plurality of first chips; and a molding layer between adjacent first chips. The molding layer covers a sidewall of the first chip and exposes a top surface of the first chip.

Packaging structure

An IoT configuration method and system for secure low power consumption proxy devices, the method comprising: registering an intelligent terminal and securely bonding the intelligent terminal to a Wi-Fi IoT device; using a secure manner to configure one proxy device in the Wi-Fi IoT as a master proxy device or master device, and then using a point-to-multipoint manner to authenticate and configure other proxy devices in the Wi-Fi IoT through the master device; establishing a secure data path between the proxy device and a low power consumption Wi-Fi device; pairing the proxy device with the Wi-Fi low power consumption device in a Wi-Fi MAC layer connectionless mode; after a triggering condition is satisfied, said low power consumption device operating and transmitting control information to said proxy device, and the proxy device forwarding the received information or adjusting the states of other devices in the network according to the received information. The present invention provides an extensible, easily configurable, and secure IoT system.

Internet of things configuration method and system for secure low-power-consumption proxy device

A semiconductor structure includes providing a substrate including a first surface and a second surface opposite to the first surface. The first surface is a functional surface. The method also includes forming a plastic seal layer on the first surface of the substrate, and performing a thinning-down process on the second surface of the substrate after forming the plastic seal layer. The plastic seal layer provides support for the substrate during the thinning-down process, and thus warping or cracking of the plastic seal layermay be avoided. In addition, the plastic seal layer can also be used as a material for packaging the substrate. Therefore, after the thinning-down process, the plastic seal layer does not need to be removed. As such, the fabrication process is simplified, and the production cost is reduced.

Semiconductor structures and fabrication methods thereof

A packaging structure and a method for fabricating the packaging structure are provided. The method includes providing a wafer. The wafer has a first surface and a second surface opposing to the first surface, and the wafer includes a plurality of first chip regions and a spacing region between adjacent first chip regions. The method also includes forming a first adhesive layer adhered to the second surface of the wafer, and forming an opening penetrating through the spacing region of the wafer and a plurality of first chips in the first chip regions on sides of the opening. Further, the method includes forming a molding layer in the opening. The molding layer covers a sidewall of the first chip and exposes a top surface of the first chip.

Packaging structure and fabrication method thereof

A connector is provided and includes a cage, a plurality of partition devices, and a heat dissipation device. The cage includes a plurality of plug receiving units that are arranged in at least a two columns by two rows arrangement. The plurality of partition devices include an upper partition plate and a lower partition plate and is positioned between two adjacent plug receiving units of the plurality of plug receiving units. The heat dissipation device includes a heat conduction block positioned between the upper partition plate and the lower partition plate, and a heat conduction pipe that contacts the heat conduction block and extends beyond a rear wall of the cage.

Connector for receiving plug and connector assembly having sandwiched heat conduction

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Shanghai, China

Jian Lu