Jialing Yang

Title: Jialing Yang: Innovator in Semiconductor Technology

Introduction

Jialing Yang is a prominent inventor based in Fremont, CA, known for his significant contributions to semiconductor technology. With a total of 7 patents, Yang has made remarkable advancements in the field, particularly in the areas of critical dimension control and high aspect ratio feature etching.

Latest Patents

Yang's latest patents include innovative methods for carbon-based depositions used for critical dimension control during high aspect ratio feature etches. One of his notable inventions involves fabricating a semiconductor substrate by vertically etching a feature into one or more layers and depositing an amorphous carbon liner onto the sidewalls of the feature. This process is iterated to achieve the desired depth while resisting lateral etching. Another significant patent focuses on film stack simplification for high aspect ratio patterning and vertical scaling. This method utilizes silicon-containing non-metal materials in a multi-layer stack, allowing for selective removal of sacrificial layers and efficient metal deposition.

Career Highlights

Throughout his career, Jialing Yang has worked with leading companies in the semiconductor industry, including Lam Research Corporation and Avanex Corporation. His expertise and innovative approaches have positioned him as a key player in advancing semiconductor manufacturing technologies.

Collaborations

Yang has collaborated with notable professionals in the field, including Meihua Shen and Thorsten B. Lill. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies.

Conclusion

Jialing Yang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor manufacturing.