Company Filing History:
Years Active: 1999-2001
Title: Jeng Gong: Innovator in Integrated Circuit Technology
Introduction
Jeng Gong is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, holding a total of 3 patents. His work focuses on reducing noise in digital signals and enhancing the performance of high voltage devices.
Latest Patents
One of Jeng Gong's latest patents is a multi-layer metallization capacitive structure designed to reduce simultaneous switching noise (SSN) in integrated circuits. This innovative structure includes at least one metallization layer that extends beneath the conductive line, along with a dielectric layer sandwiched between the power line and the metallization layer. This design optimally reduces SSN effects and can be integrated into existing processes for forming multiple interconnects, requiring less layout area compared to conventional on-chip capacitors. Another significant patent involves a high voltage device that features a first-type semiconductor substrate with a gate, along with various diffusion regions and a field oxide layer, enhancing the functionality and efficiency of high voltage applications.
Career Highlights
Jeng Gong is currently employed at United Microelectronics Corporation, where he continues to innovate in the semiconductor industry. His expertise in integrated circuit design has positioned him as a valuable asset to his company and the broader technological community.
Collaborations
Some of Jeng Gong's coworkers include Sheng-Hsing Yang and Jiann-Shiun Torng, who collaborate with him on various projects within the field of semiconductor technology.
Conclusion
Jeng Gong's contributions to integrated circuit technology through his patents demonstrate his commitment to innovation and excellence in the semiconductor industry. His work not only addresses critical challenges in digital signal processing but also paves the way for future advancements in high voltage devices.