Introduction: Jen-Chun Chen is a noted inventor from Nantou County, Taiwan, recognized for his innovative contributions in the field of electronic modules and packaging. With a total of 8 patents to his name, Chen has demonstrated a remarkable ability to enhance technology through his inventive methods.

Latest Patents: Chen's latest patents include an electronic module and method of making the same. This method entails a unique process of selective partial molding, where tapes are formed in specific areas on the circuit substrate. It includes the strategic placement of electronic components outside the designated area, encapsulated by a molding member that protects them from electromagnetic interference. Additionally, he has developed a method for manufacturing electronic package modules, which employs selective molding by applying tapes to the circuit substrate. This innovation allows for efficient manufacturing while ensuring component protection.

Career Highlights: Throughout his career, Jen-Chun Chen has worked with prominent companies such as Universal Scientific Industrial (Shanghai) Co., Ltd. and Universal Global Scientific Industrial Co., Ltd. His roles in these organizations have allowed him to explore and develop cutting-edge technologies in electronic manufacturing.

Collaborations: Chen's innovative journey has been enriched through collaborations with esteemed coworkers, including Pai-Sheng Shih and Hsin-Chin Chang. Together, they have contributed to several advancements in electronic design and manufacturing practices.

Conclusion: Jen-Chun Chen's dedication to innovation and expertise in electronic engineering is evident through his numerous patents and industry contributions. His work continues to have a significant impact on modern electronic manufacturing processes, paving the way for future advancements in technology.

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