The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Jul. 16, 2014
Applicant:

Universal Scientific Industrial (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Jen-Chun Chen, Nantou County, TW;

Tsung Jung Cheng, Nantou County, TW;

Chia Cheng Liu, Nantou County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H01L 23/552 (2006.01); H01L 27/146 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49805 (2013.01); H01L 27/14618 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49146 (2015.01);
Abstract

A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.


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