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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9332646 B1

PDFFull Text
Date of Patent:
May. 03, 2016

Filed:

Jan. 19, 2013

Electronic package module and method of manufacturing the same

Applicants:

Universal Scientific Industrial (Shanghai) Co., Ltd., Shanghai, CN;

Universal Global Scientific Industrial Co., Ltd., Nantou County, TW;

Inventors:

Jen-Chun Chen, New Taipei, TW;

Hsin-Chin Chang, Taipei, TW;

Assignees:

Universal Scientific Industrial (Shanghai) Co., Ltd., Shanghai, CN;

Universal Global Scientific Industrial Co., Ltd., Nantou County, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Angela D. Murch

Primary Examiner:

Jeremy C Norris

Assistant Examiner:

Nathan Milakovich

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01); H05K 3/28 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 23/552 (2013.01); H01L 25/16 (2013.01); H05K 3/284 (2013.01); H05K 3/30 (2013.01); H01L 23/3135 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1531 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.

Find Patent Forward Citations

Chen, Jen-Chun. (2016). Electronic package module and method of manufacturing the same (U.S. Patent No. 9332646). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9332646

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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