The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2017
Filed:
Jul. 31, 2013
Applicant:
Universal Scientific Industrial ( Shanghai) Co., Ltd., Shanghai, CN;
Inventors:
Jen-Chun Chen, Nantou County, TW;
Tsung-Jung Cheng, Nantou County, TW;
Chia-Cheng Liu, Nantou County, TW;
Assignee:
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., Shanghai, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H05K 9/00 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 27/146 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0024 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/552 (2013.01); H01L 24/02 (2013.01); H01L 27/14618 (2013.01); H05K 3/288 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0224 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1105 (2013.01);
Abstract
A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.