Tsung-Jung Cheng

Title: Tsung-Jung Cheng: Innovator in Electronic Packaging

Introduction

Tsung-Jung Cheng is a notable inventor based in Nantou County, Taiwan. He has made significant contributions to the field of electronic packaging, holding 2 patents that showcase his innovative approaches to manufacturing electronic components.

Latest Patents

Cheng's latest patents include a method of manufacturing an electronic package module. This method involves selective molding by attaching tapes on the circuit substrate, which has electric components mounted on it. The process covers the circuit substrate with a molding compound and removes the tapes along with the molding compound. Another significant patent is for a self-sealed stacked substrate structure. This structure includes a substrate unit, a first frame, a conductive unit, and a blocker unit. The substrate unit consists of a first and a second substrate, with a first frame sandwiched in between. The conductive unit features multiple first and second conductors that electrically connect the first substrate, the first frame, and the second substrate. The blocker unit surrounds the conductors and ensures a sealed connection through solder.

Career Highlights

Cheng has worked with prominent companies in the electronics industry, including Universal Scientific Industrial (Shanghai) Co., Ltd. and Universal Global Scientific Industrial Co., Ltd. His experience in these organizations has contributed to his expertise in electronic packaging technologies.

Collaborations

Throughout his career, Cheng has collaborated with talented individuals such as Jen-Chun Chen and Chia-Cheng Liu. These collaborations have likely enriched his work and led to further advancements in his field.

Conclusion

Tsung-Jung Cheng is a distinguished inventor whose work in electronic packaging has led to innovative solutions and patents. His contributions continue to impact the industry positively.