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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9144183 B1

PDFFull Text
Date of Patent:
Sep. 22, 2015

Filed:

Jul. 31, 2013

Emi compartment shielding structure and fabricating method thereof

Applicant:

Universal Scientific Industrial ( Shanghai ) Co., Ltd., Shanghai, CN;

Inventors:

Jen-Chun Chen, Nantou County, TW;

Xiao-Wen Cao, Shanghai, CN;

He- Yi Chang, Nantou County, TW;

Assignee:

Universal Scientific Industrial (Shanghai) Co., Ltd., Shanghai, CN;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Angela D. Murch

Primary Examiner:

Courtney Smith

Assistant Examiner:

Zhengfu Feng

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 3/10 (2006.01); H01L 27/14 (2006.01); H01L 21/00 (2006.01); H05K 9/00 (2006.01); H01L 21/56 (2006.01); H01L 31/0203 (2014.01); H01L 23/552 (2006.01); H01L 21/50 (2006.01); H05K 13/00 (2006.01); H01L 23/48 (2006.01); H01L 31/18 (2006.01); H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 23/552 (2013.01); H01L 31/0203 (2013.01); H05K 9/00 (2013.01); H01K 3/10 (2013.01); H01L 23/48 (2013.01); H01L 31/18 (2013.01); H05K 13/00 (2013.01);
Abstract

A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member. A conformal shield is disposed on the encapsulating member, electrically connecting the compartment structure through the notch.

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