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James E Drye

This inventor holds 11 USPTO granted patents. Top assignees: Motorola Corporation, Freescale Semiconductor,inc.. Active years: 1985-2011.

USPTO Granted Patents = 11

% Patents Active = 90.9

Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 243(Granted Patents)

Company Filing History:

Freescale Semiconductor,inc.

patents

Years Active: 1985-2011

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7969164 - Method and apparatus for mini module EMI shielding evaluation (2011-06-28),

2. 6906406 - Multiple dice package (2005-06-14),

3. 5198963 - Multiple integrated circuit module which simplifies handling and testing (1993-03-30),

4. 5164885 - Electronic package having a non-oxide ceramic bonded to metal and method (1992-11-17),

5. 4890156 - Multichip IC module having coplanar dice and substrate (1989-12-26),

6. 4800421 - Glass bonding means and method (1989-01-24),

7. 4792533 - Coplanar die to substrate bond method (1988-12-20),

8. 4722914 - Method of making a high density IC module assembly (1988-02-02),

9. 4630096 - High density IC module assembly (1986-12-16),

10. 4592794 - Glass bonding method (1986-06-03),

11. 4515898 - Glass bonding means and method (1985-05-07),

Title: Innovations of James E Drye

Introduction

James E Drye is a notable inventor based in Mesa, AZ (US), recognized for his contributions to the field of semiconductor technology. With a total of 11 patents to his name, Drye has made significant advancements in electromagnetic interference (EMI) shielding and semiconductor device design.

Latest Patents

Among his latest patents is a method and apparatus for mini module EMI shielding evaluation. This innovative method involves providing a test vehicle that includes at least one test platform. The test platform features a mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test. The evaluation process applies EMI shielding effectiveness transmission signals to the mini emitter, allowing for a comprehensive analysis of the signals received by both mini receivers. Another notable patent is for a semiconductor device designed for multiple dice, which effectively reduces insertion loss and return loss. This device comprises a package with a mount surface for the dice and a bond pad surface defining distinct die areas.

Career Highlights

Throughout his career, James E Drye has worked with prominent companies such as Motorola Corporation and Freescale Semiconductor. His experience in these organizations has contributed to his expertise in the semiconductor industry and innovation in EMI shielding technologies.

Collaborations

Drye has collaborated with several professionals in his field, including David J Reed and Vern H Winchell, II. These collaborations have likely fostered a creative environment that has led to the development of his innovative patents.

Conclusion

James E Drye's contributions to the field of semiconductor technology and EMI shielding are noteworthy. His innovative patents reflect his dedication to advancing technology and improving device performance.

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