The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 1989

Filed:

Aug. 05, 1988
Applicant:
Inventors:

James E Drye, Mesa, AZ (US);

Steven L Post, Tempe, AZ (US);

Assignee:

Motorola Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 72 ; 357 80 ; 357 81 ;
Abstract

A multichip IC module having dice and substrates coplanarly bonded therein. After the dice are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the dice and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressued and cured on the surface of the dice and substrate. This film is used as a base for interconnect lines.


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