Steven L Post

Title: Innovations of Steven L Post

Introduction

Steven L Post is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, his work has had a considerable impact on the industry.

Latest Patents

His latest patents include the "Multichip IC module having coplanar dice and substrate" and the "Coplanar die to substrate bond method." The first patent describes a multichip IC module where dice and substrates are coplanarly bonded. After aligning the dice into die openings of the substrate, a glass slurry is applied, and the module is fired to solidify the glass. Due to the shrinkage of the glass slurry during firing, a groove forms between the dice and the substrate. To fill this groove, a polyimide or similar film is adhered, pressed, and cured on the surface of the dice and substrate, serving as a base for interconnect lines. The second patent outlines a method for bonding die to substrates coplanarly in a multichip module assembly, following a similar process to the first patent.

Career Highlights

Steven L Post has had a distinguished career at Motorola Corporation, where he has been instrumental in advancing integrated circuit technologies. His innovative approaches have led to improved methods of assembling multichip modules, enhancing performance and reliability.

Collaborations

One of his notable collaborators is James E Drye. Together, they have worked on various projects that have contributed to the advancement of technology in their field.

Conclusion

Steven L Post's contributions to the field of integrated circuits through his patents and work at Motorola Corporation highlight his role as a significant innovator. His advancements continue to influence the industry and pave the way for future developments.