Motorola Corporation

Steven L Post

James E Drye

A multichip IC module having dice and substrates coplanarly bonded therein. After the dice are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the dice and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressued and cured on the surface of the dice and substrate. This film is used as a base for interconnect lines.

Multichip IC module having coplanar dice and substrate

A method for bonding die to substrates coplanarly in a multichip module assembly. After the die are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the die and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressed and cured on the surface of the die and substrate. This film is used as a base for interconnect lines.

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Tempe, AZ, United States of America

Steven L Post