The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Dec. 19, 2002
Applicants:
Lih-tyng Hwang, Crystal Lake, IL (US);
James E. Drye, Mesa, AZ (US);
Shun Meen Kuo, Chandler, AZ (US);
Inventors:
Lih-Tyng Hwang, Crystal Lake, IL (US);
James E. Drye, Mesa, AZ (US);
Shun Meen Kuo, Chandler, AZ (US);
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device for multiple dice is provided that reduces insertion loss and return loss. In an example embodiment, the semiconductor device comprises: a packagecomprising a mount surfaceto which diceandare mounted, and a bond pad surfacedefining at least a first die areaand a second die areawherein the second die areais different in form from the first die area