The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 1993

Filed:

Nov. 21, 1991
Applicant:
Inventors:

Debabrata Gupta, Scottsdale, AZ (US);

James E Drye, Mesa, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361386 ; 361387 ; 361388 ; 361400 ; 361396 ; 257737 ; 257777 ;
Abstract

A multi-chip module (26) used to interconnect and house a plurality of integrated circuits (10). The module (26) employs an intermediate structure referred to, herein, as a bridge chip (12). The bridge chip (12) connects the integrated circuit (10) to the module substrate (19). The integrated circuit (10) is attached to the bridge chip (12) and forms a composite structure (18) which can be burned-in and tested as an individual unit. The bridge chip (12) has interconnects to bring out the inputs and outputs of the integrated circuit (10). The composite structure (18) is mounted to the module substrate (19) such that, the integrated circuit (10) has a thermal pathway to the module substrate (19), and the bridge chip (12) connects to the module substrate (19). The module substrate (19) has interconnects to connect the plurality of composite structures (18).


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