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For the Inventor, By the Inventor

Gyeonggi-do, South Korea

Jae Sung Oh

This inventor holds 6 USPTO granted patents and 6 published patent applications. Top assignees: Hynix Semiconductor Inc., Skhynix Inc., Other. Active years: 2010-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Sung Oh. Retrieved from https://idiyas.com/inventor/jae-sung-oh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 38(Granted Patents)


Location History:

  • Kyoungki-do, KR (2010)
  • Gyeonggi-do, KR (2011 - 2015)
  • Icheon-si, KR (2015)

Company Filing History:

goldMedal3 out of 6,228 
 
Hynix Semiconductor Inc.
 patents
silverMedal3 out of 11,659 
 
Skhynix Inc.
 patents
bronzeMedal1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2010-2015

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6 patents (USPTO):Explore Patents
1. 9070691 - Semiconductor package and stacked semiconductor package having the same (2015-06-30),
2. 9030009 - Stacked semiconductor package and method for manufacturing the same (2015-05-12),
3. 8823158 - Semiconductor package and stacked semiconductor package having the same (2014-09-02),
4. 8299591 - Semiconductor package and stacked semiconductor package having the same (2012-10-30),
5. 8024857 - Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same (2011-09-27),
6. 7732903 - High capacity memory module using flexible substrate (2010-06-08),

Title: The Innovations of Jae Sung Oh

Introduction

Jae Sung Oh is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on advanced semiconductor packaging solutions that enhance performance and efficiency.

Latest Patents

Among his latest patents, Jae Sung Oh has developed a semiconductor package and a stacked semiconductor package. The semiconductor package includes a substrate with a body that possesses distinct regions for optimal functionality. Wiring lines are strategically placed on the substrate, connecting to a semiconductor chip housed within the package. The stacked semiconductor package features a first semiconductor chip with a through electrode and a second semiconductor chip that is bonded to the first, showcasing innovative design and manufacturing methods.

Career Highlights

Jae Sung Oh has worked with notable companies in the semiconductor industry, including SK Hynix and Hynix Semiconductor. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in semiconductor packaging.

Collaborations

Throughout his career, Jae Sung Oh has collaborated with talented individuals such as Jin Ho Gwon and Moon Un Hyun. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Jae Sung Oh's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor packaging, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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