The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Jun. 08, 2007
Applicant:
Jae Sung OH, Kyoungki-do, KR;
Inventor:
Jae Sung Oh, Kyoungki-do, KR;
Assignee:
Hynix Semiconductor Inc., Kyoungki-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A memory module includes a module substrate and a plurality of package units mounted to the module substrate such that they partially overlap each other. Each package unit has at least one memory semiconductor package attached thereto. Each package unit includes a flexible substrate, which has outer terminals provided over a lower surface adjacent to one edge thereof to form electrical connections with the module substrate, and the memory semiconductor package attached to one surface or each of both upper and lower surfaces of the flexible substrate.