Jae-Phil Boo

This inventor holds 18 USPTO granted patents and 1 published patent application, primarily in Chemical Mechanical Polishing. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae-Phil Boo. Retrieved from https://idiyas.com/inventor/jae-phil-boo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 (Patent Applications = 1)

% Patents Active = 38.9

Average Co-Inventor Count = 4.5

ph-index = 7

Forward Citations = 191(Granted Patents)

Location History:

Suwon-shi, KR (2004)
Kyunggi-do, KR (2005 - 2006)
Suwon, KR (2002 - 2007)
Gyeonggi-do, KR (2006 - 2007)
Seongnam, KR (2007)
Seongnam-si, KR (2005 - 2017)

Company Filing History:

18 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2002-2017

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Areas of Expertise:

Chemical Mechanical Polishing

Polishing Apparatus

Polishing Pad

Semiconductor Wafer

Carrier Head

Pressure Chamber

Slurry

Polishing Method

Fabrication Process

Non-Volatile Memory

MOS Transistor

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9620392 - Single type apparatus for drying a substrate and single type system for cleaning a substrate including the same (2017-04-11),

2. 8790158 - Chemical mechanical polishing apparatus (2014-07-29),

3. 8734206 - Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the same (2014-05-27),

4. 7303466 - Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones (2007-12-04),

5. 7223158 - Method for polishing a semiconductor wafer (2007-05-29),

6. 7196011 - Apparatus and method for treating substrates (2007-03-27),

7. 7196010 - Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same (2007-03-27),

8. 7081045 - Apparatus for polishing a semiconductor wafer (2006-07-25),

9. 7052368 - Polishing pad for chemical mechanical polishing apparatus (2006-05-30),

10. 6945861 - Polishing head of chemical mechanical polishing apparatus and polishing method using the same (2005-09-20),

11. 6921323 - Apparatus for polishing a semiconductor wafer and method therefor (2005-07-26),

12. 6881135 - Polishing head of chemical mechanical polishing apparatus and polishing method using the same (2005-04-19),

13. 6840846 - Polishing station of a chemical mechanical polishing apparatus (2005-01-11),

14. 6769973 - Polishing head of chemical mechanical polishing apparatus and polishing method using the same (2004-08-03),

15. 6709920 - Method of fabricating a non-volatile memory device having a tunnel-insulating layer including more than two portions of different thickness (2004-03-23),

Title: Jae-Phil Boo: Innovator in Substrate Processing Technologies

Introduction

Jae-Phil Boo is a prominent inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of substrate processing, holding a total of 18 patents. His innovative work primarily focuses on apparatuses and systems that enhance the efficiency of substrate drying and cleaning processes.

Latest Patents

Among his latest patents, Jae-Phil Boo has developed a "Single type apparatus for drying a substrate" and a "Single type system for cleaning a substrate including the same." The drying apparatus features a spin chuck designed to support and rotate the substrate within a drying chamber. This chamber is equipped with an inlet, outlet, and vortex exhaust, allowing for effective drying fluid circulation. Additionally, his "Chemical mechanical polishing apparatus" includes a platen with a dual-region design, a polishing pad, and a slurry supply system, which enhances the precision of wafer polishing.

Career Highlights

Jae-Phil Boo has established himself as a key figure in the innovation landscape at Samsung Electronics Co., Ltd. His work has not only advanced substrate processing technologies but has also contributed to the overall efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Jae-Phil Boo has collaborated with notable colleagues, including Jun-Gyu Ryu and Sang-Seon Lee. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Jae-Phil Boo's contributions to substrate processing technologies exemplify the impact of innovative thinking in the semiconductor industry. His patents reflect a commitment to enhancing manufacturing processes, making him a valuable asset to Samsung Electronics Co., Ltd. and the broader field of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: