The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Feb. 24, 2011
One-moon Chang, Yongin-si, KR;
Jae-phil Boo, Seongnam-si, KR;
Jong-bok Kim, Suwon-si, KR;
Soo-young Tak, Suwon-si, KR;
Jong-sun Ahn, Hwaseong-si, KR;
Shin Kim, Hwaseong-si, KR;
One-Moon Chang, Yongin-si, KR;
Jae-Phil Boo, Seongnam-si, KR;
Jong-Bok Kim, Suwon-si, KR;
Soo-Young Tak, Suwon-si, KR;
Jong-Sun Ahn, Hwaseong-si, KR;
Shin Kim, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.