Jae Hyun Lim

Title: Inventor Spotlight: Jae Hyun Lim and His Innovations in Semiconductor Packages

Introduction:

In today's Inventor Spotlight, we explore the remarkable contributions of Jae Hyun Lim, an inventive mind hailing from Suwon-si, South Korea. With an impressive record of 14 patents, Lim has played a significant role in advancing semiconductor packaging technology. Let's take a closer look at some of his latest breakthroughs and the companies he has collaborated with.

Background:

Jae Hyun Lim has gained recognition for his exceptional work in the field of semiconductor packages, specializing in creating efficient, compact, and high-performance electronic components. With strategic collaborations in renowned companies such as Samsung-Electro Mechanics Co., Ltd. and Samsung Electronics Co., Ltd., Lim's contributions have had a profound impact on the industry.

Latest Innovations:

One of Lim's notable inventions is the semiconductor package with a through-hole. This package design includes a frame with a through-hole, accommodating a first semiconductor chip. The chip features an active surface with connection pads, an inactive surface, and a side surface connecting the two. A first encapsulant covers the inactive surface and side surface of the chip, providing protection and insulation. Moreover, a connection structure with a redistribution layer enables electrical connections to the chip's connection pads. Lim's design also incorporates a first passive component, with a thickness greater than that of the semiconductor chip, situated on the connection structure. This innovation enhances the overall performance and functionality of the semiconductor package.

Another significant advancement by Lim is the semiconductor package that features a through-hole including a shielding wiring structure. In this design, a frame with opposing surfaces houses a connection structure with a redistribution layer. A semiconductor chip, connected to the redistribution layer via connection pads, is encapsulated by an encapsulant covering the second surface of the frame. Additionally, multiple electrical connection metal members are situated on the second surface, establishing connections to the wiring structure. Notably, the wiring structure includes a shielding wiring structure that surrounds the through-hole. To ensure proper grounding, numerous grounding electrical connection metal members are connected to the shielding wiring structure. This innovation provides improved signal integrity and electromagnetic interference shielding.

Collaborators:

Throughout his career, Jae Hyun Lim has had the pleasure of working alongside exceptional colleagues who have contributed to his success. Notable coworkers include Sang Jong Lee and Han Kim, who have played vital roles in jointly developing and refining the patented semiconductor package designs.

Conclusion:

Jae Hyun Lim's remarkable innovations in the field of semiconductor packaging have positioned him as a respected figure in the industry. With his numerous patents and collaborations with prominent companies like Samsung, Lim's contributions continue to shape and advance the world of electronic components. Stay tuned for more exciting developments from this prolific inventor.

Disclaimer: The information provided in this article is based on the available data and does not claim to be an exhaustive account of Jae Hyun Lim's inventions and career.