The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2021
Filed:
Jun. 06, 2019
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Yoon Seok Seo, Suwon-si, KR;
Dae Hyun Park, Suwon-si, KR;
Sang Jong Lee, Suwon-si, KR;
Chul Kyu Kim, Suwon-si, KR;
Jae Hyun Lim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.