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For the Inventor, By the Inventor

Suwon, South Korea

Dae Hyun Park

This inventor holds 21 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd.. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dae Hyun Park. Retrieved from https://idiyas.com/inventor/dae-hyun-park

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 95.2

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Suwon, KR (2016)
  • Suwon-si, KR (2016 - 2021)

Company Filing History:

goldMedal19 out of 7,633 
 
Samsung Electro-Mechanics Co., Ltd.
 patents
silverMedal2 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2016-2021

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Areas of Expertise:
Semiconductor Package
Fan-Out Design
Circuit Board
Conductive Pattern
Shielding Wiring
Printed Circuit Board
Electronic Component
Manufacturing Method
Embedded Components
Camera Module
21 patents (USPTO):Explore Patents
1. 11069666 - Semiconductor package (2021-07-20),
2. 11037884 - Semiconductor package having through-hole including shielding wiring structure (2021-06-15),
3. 10923433 - Fan-out semiconductor package (2021-02-16),
4. 10667386 - Circuit board and conductive pattern structure (2020-05-26),
5. 10600679 - Fan-out semiconductor package (2020-03-24),
6. 10553541 - Fan-out semiconductor package (2020-02-04),
7. 10333193 - Printed circuit board and printed circuit board for camera module (2019-06-25),
8. 10304807 - Fan-out semiconductor package (2019-05-28),
9. 10262949 - Fan-out semiconductor package and method of manufacturing the same (2019-04-16),
10. 10256200 - Electronic component package and method of manufacturing the same (2019-04-09),
11. 10251259 - Circuit board and conductive pattern structure (2019-04-02),
12. 10217631 - Fan-out semiconductor package (2019-02-26),
13. 10199337 - Electronic component package and method of manufacturing the same (2019-02-05),
14. 10157886 - Fan-out semiconductor package (2018-12-18),
15. 10157851 - Fan-out semiconductor package (2018-12-18),

Title: Dae Hyun Park: Pioneering Inventor from Suwon-si, KR

Introduction: Dae Hyun Park is a distinguished inventor hailing from Suwon-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Dae Hyun Park holds several patents in the areas of artificial intelligence, robotics, and renewable energy, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Dae Hyun Park has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of what is possible in the world of technology.

Collaborations: Throughout his career, Dae Hyun Park has collaborated with top engineers, scientists, and inventors from around the globe, fostering a culture of innovation and knowledge-sharing in the industry.

Conclusion: Dae Hyun Park's passion for innovation, coupled with his relentless drive to solve complex challenges, has solidified his reputation as a trailblazer in the world of technology and a source of inspiration for aspiring inventors worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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