The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Jun. 29, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Dae Hyun Park, Suwon-Si, KR;
Han Kim, Suwon-Si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01P 3/02 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01P 3/026 (2013.01); H01P 3/085 (2013.01); H04N 5/2257 (2013.01); H05K 1/0253 (2013.01); H05K 1/0245 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/10204 (2013.01);
Abstract
A printed circuit board and a printed circuit board includes a signal transmitting part; a ground part that includes an impedance adjusting part and a dummy part; and an insulating layer disposed between the signal transmitting part and the ground part.
Park, Dae. (2019). Printed circuit board and printed circuit board for camera module (U.S. Patent No. 10333193). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10333193
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile