The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Sep. 17, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Hyun Lim, Suwon-Si, KR;

Yoon Seok Seo, Suwon-Si, KR;

Kyung Moon Jung, Suwon-Si, KR;

Eun Jin Kim, Suwon-Si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 27/146 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01);
Abstract

A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.


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