The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2019
Filed:
Apr. 25, 2018
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Jae Hyun Lim, Suwon-Si, KR;
Han Kim, Suwon-Si, KR;
Eun Jung Jo, Suwon-Si, KR;
Jung Ho Shim, Suwon-Si, KR;
Sang Jong Lee, Suwon-Si, KR;
Hyung Joon Kim, Suwon-Si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;
Abstract
The fan-out semiconductor package includes: a metal member including a metal plate having a first through-hole and second through-holes and metal posts disposed in the second through-holes; a semiconductor chip disposed in the first through-hole; an encapsulant covering at least portion of each of the metal member and the semiconductor chip and filling at least portions of each of the first and second through-holes; a wiring layer disposed on the encapsulant; first vias electrically connecting the wiring layer and the connection pads to each other; and second vias electrically connecting the wiring layer and the metal posts to each other, wherein a height of the second vias is greater than that of the first vias or a thickness of the metal plate is the same as that of the metal post.