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For the Inventor, By the Inventor

Icheon, South Korea

Jae Hoon Lee

This inventor holds 10 USPTO granted patents. Top assignee: Skhynix Inc.. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Hoon Lee. Retrieved from https://idiyas.com/inventor/jae-hoon-lee-b6o3sq6u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Icheon-si, KR (2018 - 2023)
  • Icheon-si Gyeonggi-do, KR (2023)

Company Filing History:

goldMedal10 out of 11,678 
 
Skhynix Inc.
 patents

Years Active: 2018-2025

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10 patents (USPTO):Explore Patents
1. 12501539 - Substrate including a reference voltage layer having an impedance calibrator (2025-12-16),
2. 11715708 - Semiconductor package including decoupling capacitor (2023-08-01),
3. 11682627 - Semiconductor package including an interposer (2023-06-20),
4. 11342315 - Stack packages including through mold via structures (2022-05-24),
5. 11322475 - Stack semiconductor packages having wire-bonding connection structure (2022-05-03),
6. 11183470 - Semiconductor package including decoupling capacitor (2021-11-23),
7. 10998281 - Semiconductor packages (2021-05-04),
8. 10985099 - Semiconductor packages (2021-04-20),
9. 10665570 - Stack packages including through mold vias (2020-05-26),
10. 10115708 - Semiconductor package having a redistribution line structure (2018-10-30),

Title: Jae Hoon Lee: Innovator in Semiconductor Technology

Introduction

Jae Hoon Lee is a prominent inventor based in Icheon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His innovative work focuses on enhancing the performance and efficiency of semiconductor packages and substrates.

Latest Patents

One of Jae Hoon Lee's latest patents is a substrate that includes a reference voltage layer with an impedance calibrator. This substrate features a signal transmission layer with a signal transmission pad and interconnection, along with a first dielectric layer and a first reference voltage layer. The first reference voltage layer is designed with a first space hole and an impedance calibrator, which includes an impedance calibration part and a bridge connecting it to the reference voltage layer.

Another notable patent is a semiconductor package that incorporates a decoupling capacitor. This package consists of a substrate and a semiconductor chip positioned above it. The substrate includes a base layer with an upper surface facing the chip, an upper ground electrode plate for transmitting ground voltage, and a dummy power pattern surrounded by insulating material. This design ensures that the ground voltage transmission path is effectively separated from the dummy power pattern.

Career Highlights

Jae Hoon Lee is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work at SK Hynix has allowed him to collaborate with other talented professionals in the field, contributing to advancements in semiconductor technology.

Collaborations

Some of Jae Hoon Lee's coworkers include Ju Il Eom and Juil Eom. Their collaborative efforts have played a crucial role in the development of innovative semiconductor solutions.

Conclusion

Jae Hoon Lee's contributions to semiconductor technology through his patents and work at SK Hynix Inc. highlight his role as a key innovator in the industry. His inventions continue to influence the advancement of semiconductor applications and technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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