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Icheon-si, South Korea

Jae Hoon Lee

USPTO Granted Patents = 9

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 6(Granted Patents)

Location History:

Icheon-si, KR (2018 - 2023)
Icheon-si Gyeonggi-do, KR (2023)

Company Filing History:

9 out of 10,938

Years Active: 2018-2023

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11715708 - Semiconductor package including decoupling capacitor (2023-08-01),

2. 11682627 - Semiconductor package including an interposer (2023-06-20),

3. 11342315 - Stack packages including through mold via structures (2022-05-24),

4. 11322475 - Stack semiconductor packages having wire-bonding connection structure (2022-05-03),

5. 11183470 - Semiconductor package including decoupling capacitor (2021-11-23),

6. 10998281 - Semiconductor packages (2021-05-04),

7. 10985099 - Semiconductor packages (2021-04-20),

8. 10665570 - Stack packages including through mold vias (2020-05-26),

9. 10115708 - Semiconductor package having a redistribution line structure (2018-10-30),

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