The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Nov. 07, 2018
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Abstract
A stack package includes a first sub-package and a second sub-package stacked on the first sub-package. The first sub-package includes a first semiconductor chip, a first through mold via (TMV) for connection that is spaced apart from the first semiconductor chip in an X-axis direction, a first TMV for bypass that is spaced apart from the first semiconductor chip in a Y-axis direction, and a redistribution line (RDL) pattern for connecting the first semiconductor chip to the first TMV for connection. The second sub-package includes a second semiconductor chip, a second TMV for connection that is spaced apart from the second semiconductor chip in the Y-axis direction, and another RDL pattern for connecting the second semiconductor chip to the second TMV for connection. The second sub-package stacked is stacked on the first sub-package such that the second TMV for connection is connected to the first TMV for bypass.