The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Feb. 27, 2017
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/02 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 23/3128 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0912 (2013.01); H01L 2224/17104 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01);
Abstract
A semiconductor package may include a first semiconductor chip having first bonding pads on a first active surface. The semiconductor package may include a second semiconductor chip having second bonding pads which are arranged on a second active surface. The first and second semiconductor chips are stacked such that the first and second active surfaces face each other.