San Jose, CA, United States of America

Jacques Leibovitz


Average Co-Inventor Count = 3.2

ph-index = 12

Forward Citations = 652(Granted Patents)


Company Filing History:


Years Active: 1991-2001

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19 patents (USPTO):Explore Patents

Title: Innovations of Jacques Leibovitz in Semiconductor Technology

Introduction

Jacques Leibovitz is a prominent inventor located in San Jose, California, recognized for his significant contributions in the field of semiconductor technology. With a remarkable portfolio of 19 patents, his work has played a crucial role in advancing the efficiency and performance of electronic devices.

Latest Patents

One of Jacques Leibovitz's latest patents presents a method and structure for creating uniform height solder bumps on a semiconductor wafer. This innovative technique involves the exposure of a dummy pattern of under bump metal for solder plating. The pattern mirrors the outline of die present on the semiconductor wafer. By strategically removing portions of a photoresist layer deposited over the under bump metal, the dummy pattern is exposed simultaneously with the under bump metal above the contact pads. This technique ensures that solder material is uniformly plated onto both the exposed under bump metal and the dummy pattern. The ingenious design circumvents current crowding issues, leading to a more even plating current density and subsequently producing solder bumps of uniform height. This advancement significantly improves the reliability and performance of semiconductor devices.

Career Highlights

Throughout his career, Jacques Leibovitz has been associated with notable companies in the tech industry, including Hewlett-Packard Company. His endeavors have not only enhanced manufacturing processes but have also paved the way for further innovations in semiconductor application.

Collaborations

Jacques has collaborated with esteemed individuals such as Clinton C. Chao and Maria L. Cobarruviaz. These partnerships have contributed to the success of his projects, promoting the exchange of ideas and expertise within the realm of semiconductor technology.

Conclusion

In summary, Jacques Leibovitz's innovative methods for solder bump creation represent significant advancements in the semiconductor field. His extensive patent portfolio and collaborative efforts reflect his dedication to improving electronic device performance. Through his contributions, Jacques continues to inspire future generations of inventors and innovators in the technology landscape.

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