The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2000
Filed:
Feb. 01, 1999
Jacques Leibovitz, San Jose, CA (US);
Park-Kee Yu, San Jose, CA (US);
Ya Yun Zhu, Cupertino, CA (US);
Maria L Cobarruviaz, Cupertino, CA (US);
Susan J Swindlehurst, Redwood City, CA (US);
Cheng-Cheng Chang, Palo Alto, CA (US);
Kenneth D Scholz, Palo Alto, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
An integrated circuit redistribution structure. The integrated circuit redistribution structure includes a plurality of conductive pads located on an active side of an integrated circuit. The integrated circuit redistribution structure includes a redistribution layer and an under bump material structure for receiving a solder bump. The redistribution layer can include a first mechanically protective layer which adheres to the active side of the integrated circuit. The redistribution layer includes a plurality of conductive lines in which at least one of the conductive lines is connected to at least one conductive pad. Each conductive line includes an adhesion and diffusion barrier layer, an electrical conductor layer, and a first metallic protective layer. The under bump material structure is formed over at least one conductive line. The under bump material structure includes a solder wettable metal layer formed over the redistribution layer, and a second metallic protective layer for receiving the solder bump.