The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 1997
Filed:
Mar. 31, 1995
Peter F Dawson, deceased, late of Portola Valley, CA (US);
Jacques Leibovitz, San Jose, CA (US);
Voddarahalli K Nagesh, Cupertino, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
The flip chip package described is comprised of a substrate, a ring structure attached to the substrate, a heat removal structure, and a chip thermally coupled to the heat removal structure. The package lid is comprised of a ring structure and a heat removal structure. The ring structure and heat removal structure are separated until after attachment of the ring structure to the substrate allowing the ring structure to be brazed to the substrate. Brazing the ring structure to the substrate decreases the mechanical stress to the chip. A die attach material, between the first major surface of the die and the first major surface of the heat removal structure, adheres the die to and thermally couples the die to the heat removal structure. The die attach layer is of a predetermined thickness and thus provides a determined low thermal resistance making the thermal performance of the package certain.