The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1998
Filed:
Sep. 21, 1994
Jacques Leibovitz, San Jose, CA (US);
Peter F Dawson, Portola Valley, CA (US);
Voddarahalli K Nagesh, Cupertino, CA (US);
Greg M Irby, San Jose, CA (US);
Other;
Abstract
A silicon die, such as an integrated circuit, is reworkably bonded to a copper heat spreader. The silicon-copper bond exhibits high compliance under conditions of thermal stress even though there is a significant thermal coefficient of expansion difference between silicon and copper. A compliant adhesive is applied to the surface of one of the silicon die and the copper heat spreader and is cured. Thereafter, a thermoplastic adhesive is applied to bond the silicon die to the copper heat spreader. A composite bond is thereby produced, including a highly compliant layer and a thermoplastic layer. The die may be reworked by heating the thermoplastic adhesive until the bond begins to soften and the die is released.