Peter F Dawson

Title: Innovations by Peter F Dawson

Introduction

Peter F Dawson is an accomplished inventor based in Portola Valley, California. He holds 2 patents that showcase his expertise in the field of integrated circuits and thermal management solutions. His innovative approaches have contributed significantly to advancements in technology.

Latest Patents

Dawson's latest patents include the "Reworkable die attachment to heat spreader" and "Reworkable die attachment." The first patent describes a method for reworkably bonding a silicon die, such as an integrated circuit, to a copper heat spreader. This method utilizes a compliant adhesive that maintains high performance under thermal stress, despite the differing thermal expansion coefficients of silicon and copper. The second patent outlines a technique for reworkably attaching an integrated circuit to a circuit board, ensuring a stable bond under high thermal stress conditions. This innovative approach allows for easy removal of the integrated circuit without damaging the circuit board.

Career Highlights

Throughout his career, Dawson has worked with notable companies, including Hewlett-Packard Company. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements.

Collaborations

Dawson has collaborated with talented individuals such as Jacques Leibovitz and Voddarahalli K Nagesh. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Peter F Dawson's contributions to the field of integrated circuits and thermal management are noteworthy. His innovative patents reflect his dedication to advancing technology and improving product reliability.