This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 1998.
Company Filing History:
Years Active: 1998
Title: Greg M Irby: Innovator in Thermal Management Solutions
Introduction
Greg M Irby is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of thermal management, particularly through his innovative patent that addresses the challenges of bonding silicon dies to heat spreaders.
Latest Patents
Greg M Irby holds a patent for a "Reworkable die attachment to heat spreader." This invention involves a silicon die, such as an integrated circuit, that is reworkably bonded to a copper heat spreader. The unique silicon-copper bond demonstrates high compliance under thermal stress conditions, despite the significant difference in thermal coefficients of expansion between silicon and copper. The process includes applying a compliant adhesive to one surface of the silicon die and the copper heat spreader, which is then cured. Following this, a thermoplastic adhesive is used to bond the silicon die to the copper heat spreader, resulting in a composite bond that features both a highly compliant layer and a thermoplastic layer. This innovative design allows for the die to be reworked by heating the thermoplastic adhesive until the bond softens, enabling the die to be released.
Career Highlights
Throughout his career, Greg has focused on developing solutions that enhance the reliability and performance of electronic components. His work has been instrumental in advancing thermal management technologies, which are critical in the electronics industry.
Collaborations
Greg M Irby has collaborated with notable professionals in his field, including Jacques Leibovitz and Peter F Dawson. These partnerships have contributed to the development and refinement of his innovative solutions.
Conclusion
Greg M Irby is a distinguished inventor whose work in thermal management has led to significant advancements in the industry. His innovative patent demonstrates his commitment to improving the reliability of electronic components through effective thermal solutions.