Ismail C Noyan

This inventor holds 25 USPTO granted patents, primarily in Electronic Packaging. Top assignees: International Business Machines Corporation, Other. Active years: 1991-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ismail C Noyan. Retrieved from https://idiyas.com/inventor/ismail-c-noyan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 25

% Patents Active = 96.0

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 312(Granted Patents)

Location History:

Yorktown Heights, NY (US) (1995 - 2003)
Peekskill, NY (US) (1991 - 2004)
Chappaqua, NY (US) (2007)

Company Filing History:

24 out of 166,425

International Business Machines Corporation

patents

1 out of 834,601

Other

patents

Years Active: 1991-2007

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Areas of Expertise:

Electronic Packaging

Thermal Interposer

Multilayer Conductor

Electro-Optical Connectors

Thin Films

Solder Bonding

Semiconductor Films

Wirebond Removal

Coolant Permeable Support

Epitaxial Growth

Chip Packaging

Optical Bus

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7214548 - Apparatus and method for flattening a warped substrate (2007-05-08),

2. 6734363 - Lightweight electronic equipment conductor with coolant permeable support (2004-05-11),

3. 6503641 - Interconnects with Ti-containing liners (2003-01-07),

4. 6211042 - Growth of epitaxial semiconductor films in presence of reactive metal (2001-04-03),

5. 6029199 - Computing system having a system supervisor and a collection of (2000-02-22),

6. 6017401 - Conductivity improvement in thin films of refractory metal (2000-01-25),

7. 5915462 - High efficiency thermal interposer (1999-06-29),

8. 5847926 - Lightweight packaging (1998-12-08),

9. 5768770 - Electronic packaging shaped beam lead fabrication (1998-06-23),

10. 5675884 - Apparatus for multilayer conductor chip packaging (1997-10-14),

11. 5669437 - High efficiency thermal interposer (1997-09-23),

12. 5446261 - Solder application system using helix to control solder meniscus (1995-08-29),

13. 5322204 - Electronic substrate multiple location conductor attachment technology (1994-06-21),

14. 5263620 - Wirebond removal apparatus using alternating fluid stream (1993-11-23),

15. 5233221 - Electronic substrate multiple location conductor attachment technology (1993-08-03),

Title: Spotlight on Inventor Ismail C Noyan

Introduction:

Ismail C Noyan, a prolific inventor based in Peekskill, NY, has made significant contributions to the field of innovation with an impressive portfolio of 25 patents to his name.

Latest Patents:

Among his latest patents is the groundbreaking "Apparatus and Method for Flattening a Warped Substrate," a method that involves flattening a warped substrate by placing it on a planar surface of a clamping apparatus.

Career Highlights:

Noyan has a distinguished career, having worked at esteemed companies such as the International Business Machines Corporation (IBM), where he honed his skills and expertise in the realm of invention and innovation.

Collaborations:

Throughout his career, Noyan has collaborated with talented individuals in the industry, including coworkers Raymond R Horton and Michael J Palmer, who have contributed to the success of his inventive endeavors.

Conclusion:

Inventor Ismail C Noyan's impressive body of work stands as a testament to his dedication to pushing the boundaries of innovation. With a keen eye for problem-solving and a passion for creating groundbreaking solutions, Noyan continues to make waves in the world of patents and inventions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]