IDiyas

For the Inventor, By the Inventor

Peekskill, NY, United States of America

Ismail C Noyan

USPTO Granted Patents = 25

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 311(Granted Patents)


Location History:

  • Yorktown Heights, NY (US) (1995 - 2003)
  • Peekskill, NY (US) (1991 - 2004)
  • Chappaqua, NY (US) (2007)

Company Filing History:

goldMedal24 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 1991-2007

where 'Filed Patents' based on already Granted Patents

25 patents (USPTO):
1. 7214548 - Apparatus and method for flattening a warped substrate (2007-05-08),
2. 6734363 - Lightweight electronic equipment conductor with coolant permeable support (2004-05-11),
3. 6503641 - Interconnects with Ti-containing liners (2003-01-07),
4. 6211042 - Growth of epitaxial semiconductor films in presence of reactive metal (2001-04-03),
5. 6029199 - Computing system having a system supervisor and a collection of (2000-02-22),
6. 6017401 - Conductivity improvement in thin films of refractory metal (2000-01-25),
7. 5915462 - High efficiency thermal interposer (1999-06-29),
8. 5847926 - Lightweight packaging (1998-12-08),
9. 5768770 - Electronic packaging shaped beam lead fabrication (1998-06-23),
10. 5675884 - Apparatus for multilayer conductor chip packaging (1997-10-14),
11. 5669437 - High efficiency thermal interposer (1997-09-23),
12. 5446261 - Solder application system using helix to control solder meniscus (1995-08-29),
13. 5322204 - Electronic substrate multiple location conductor attachment technology (1994-06-21),
14. 5263620 - Wirebond removal apparatus using alternating fluid stream (1993-11-23),
15. 5233221 - Electronic substrate multiple location conductor attachment technology (1993-08-03),

Title: Spotlight on Inventor Ismail C Noyan

Introduction:

Ismail C Noyan, a prolific inventor based in Peekskill, NY, has made significant contributions to the field of innovation with an impressive portfolio of 25 patents to his name.

Latest Patents:

Among his latest patents is the groundbreaking "Apparatus and Method for Flattening a Warped Substrate," a method that involves flattening a warped substrate by placing it on a planar surface of a clamping apparatus.

Career Highlights:

Noyan has a distinguished career, having worked at esteemed companies such as the International Business Machines Corporation (IBM), where he honed his skills and expertise in the realm of invention and innovation.

Collaborations:

Throughout his career, Noyan has collaborated with talented individuals in the industry, including coworkers Raymond R Horton and Michael J Palmer, who have contributed to the success of his inventive endeavors.

Conclusion:

Inventor Ismail C Noyan's impressive body of work stands as a testament to his dedication to pushing the boundaries of innovation. With a keen eye for problem-solving and a passion for creating groundbreaking solutions, Noyan continues to make waves in the world of patents and inventions.

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