International Business Machines Corporation

Other

Ismail C Noyan

Raymond R Horton

Michael J Palmer

Mark F Bregman

Alphonso Philip Lanzetta

Ho-Ming Tong

Mark B Ritter

Bernardo Hernandez

William D Brewer

Sampath Purushothaman

David Lee Rath

Fenton Read McFeely

John Jacob Yurkas

Kurt R Grebe

Linda C Matthew

Cyril Cabral, Jr

Kim Yang Lee

Thomas M Shaw

Lawrence Shungwei Mok

Conal Eugene Murray

Chao-Kun Hu

Roy Arthur Carruthers

Mitchell S Cohen

Robert Rosenberg

Glen Walden Johnson

Modest M Oprysko

Harry R Bickford

Harold S Stone

Caroline A Kovac

Dennis L Rogers

James McKell Edwin Harper

Steffen K Kaldor

Mohammed Fazil Fayaz

Roger Alan Pollak

William Edward Pence, Iv

Richard Ian Kaufman

Ricky A Rand

Arthur Robert Williams

Frederick G Weindelmayer

William E Pence, Iv

John C Zyzo

Mark John Allen

Jeanine M Trewhella

Jeffrey Joseph Kleikamp

Anne L Petrosky

A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S, S, . . . , Shaving an average warpage of W, W, . . . , W, respectively, wherein W&#x2266;W&#x2266; . . . &#x2266;Wand W&#x2266;W. Zones Z, Z, . . . , Zof the planar surface respectively comprise vacuum port groups G, G, . . . , G. Each group comprises at least one vacuum port. N is at least 2. A vacuum pressure P, P, . . . , Pis generated at each vacuum port within group G, G, . . . , G, at a time of T, T, . . . , Tto clamp surface region S, S, . . . , Sto zone Z, Z, . . . , Z, respectively. The vacuum pressure P, P, . . . , Pis maintained at the vacuum ports of group G, G, . . . , G, respectively, until time T. T&#x3c;T&#x3c; . . . &#x3c;T&#x3c;T.

Apparatus and method for flattening a warped substrate

The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.

Lightweight electronic equipment conductor with coolant permeable support

An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf; and a liner abutting the conductor body which is formed of an alloy that includes Ta, W, Ti, Nb and V. The invention further discloses a liner for use in a semiconductor interconnect that is formed of a material selected from the group consisting of Ti, Hf, In, Sn, Zr and alloys thereof, TiCu , Ta Ti , Ta , Hf , Ta , In , Ta Sn , Ta Zr .

Interconnects with Ti-containing liners

A method is disclosed for forming an epitaxial layer of a semiconductor material over a metal structure disposed upon a surface of a semiconductor substrate, the metal being characterized by a negative Gibbs free energy for the formation of a compound of the metal and the semiconductor material. The method comprises the steps of: a) placing the substrate in a reactor vessel having a base pressure in the ultra high vacuum range, b) bringing the substrate to an elevated temperature, and c) flowing, over said substrate, a halogen-free precursor gas of molecules comprising the semiconductor material. Typically, the metal structure characterized by feature dimensions of less than 2.0 microns. Preferably, the metal is tungsten, the semiconductor material is silicon and the gas comprises a silane of the form Si,H,, where n is a positive integer.

Growth of epitaxial semiconductor films in presence of reactive metal

The present invention is directed to a computing system which contains a plurality of subunits. Each subunit contains a computing subcomponent and a subunit supervisor subcomponent. The subunit supervisor component monitors functions of the subunit and output signals corresponding to the monitored functions. The plurality of subunits are contained within a housing. The housing contains a housing supervisor subunit which receives the output signals of each of the plurality of subunits. The supervisor subunit outputs the accumulated signals to an input/output device for monitoring the plurality of subunits and for sending commands to each subunit.

Computing system having a system supervisor and a collection of

A method of increasing conductivity of a refractory metal film disposed upon a substrate includes exposing the refractory metal film to an atmosphere comprising a silane of the form Si.sub.n H.sub.(2n+2), where n is a positive integer, while subjecting the refractory metal film to a temperature in excess of 700 degrees Celsius and to a base pressure not exceeding 10.sup.-8 torr for a time period which is chosen to be sufficiently long to increase the conductivity of the refractory metal film to a correspondingly sufficient degree.

Conductivity improvement in thin films of refractory metal

A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.

High efficiency thermal interposer

The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding. It achieves the packaging benefits by having;

Lightweight packaging

Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Electronic packaging shaped beam lead fabrication

Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

Apparatus for multilayer conductor chip packaging

A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.

Solder application system using helix to control solder meniscus

A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Electronic substrate multiple location conductor attachment technology

A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

Wirebond removal apparatus using alternating fluid stream

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Peekskill, NY, United States of America

Ismail C Noyan