The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 1993

Filed:

Feb. 28, 1992
Applicant:
Inventors:

Bernardo Hernandez, Norwalk, CT (US);

Raymond R Horton, Dover Plains, NY (US);

Ismail C Noyan, Peekskill, NY (US);

Michael J Palmer, Walden, NY (US);

Mark B Ritter, Brookfield, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B26F / ;
U.S. Cl.
CPC ...
225-1 ; 225 93 ; 225 97 ; 294264 ; 29762 ; 228264 ; 2281805 ; 239562 ;
Abstract

A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.


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