The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2007

Filed:

Aug. 30, 2004
Applicants:

Mohammed F. Fayaz, Pleasantville, NY (US);

Steffen K. Kaldor, Fishkill, NY (US);

Conal E. Murray, Yorktown Heights, NY (US);

Ismail C. Noyan, Chappaqua, NY (US);

Anne L. Petrosky, Lagrangeville, NY (US);

Inventors:

Mohammed F. Fayaz, Pleasantville, NY (US);

Steffen K. Kaldor, Fishkill, NY (US);

Conal E. Murray, Yorktown Heights, NY (US);

Ismail C. Noyan, Chappaqua, NY (US);

Anne L. Petrosky, Lagrangeville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S, S, . . . , Shaving an average warpage of W, W, . . . , W, respectively, wherein W≦W≦ . . . ≦Wand W≦W. Zones Z, Z, . . . , Zof the planar surface respectively comprise vacuum port groups G, G, . . . , G. Each group comprises at least one vacuum port. N is at least 2. A vacuum pressure P, P, . . . , Pis generated at each vacuum port within group G, G, . . . , G, at a time of T, T, . . . , Tto clamp surface region S, S, . . . , Sto zone Z, Z, . . . , Z, respectively. The vacuum pressure P, P, . . . , Pis maintained at the vacuum ports of group G, G, . . . , G, respectively, until time T. T<T< . . . <T<T.


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