I-Chia Lin

Title: I-Chia Lin: Innovator in Semiconductor Packaging Technology

Introduction

I-Chia Lin is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative structures and methods that enhance the performance and reliability of electronic components.

Latest Patents

Among his latest patents, I-Chia Lin has developed an embedded component package structure. This structure includes a circuit substrate, an embedded component, and a stress compensation layer. The circuit substrate features a core layer with an asymmetric circuit structure, while the stress compensation layer is designed to manage stress within the package. Another notable patent is for a semiconductor device package, which comprises a carrier, an electronic component, and a package body that covers the component. This package also includes a shield layer with multiple magnetically permeable and electrically conductive layers, enhancing the device's performance.

Career Highlights

I-Chia Lin is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His innovative designs and methods have positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.

Collaborations

Throughout his career, I-Chia Lin has collaborated with talented individuals such as Chieh-Chen Fu and Cheng-Nan Lin. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

I-Chia Lin's contributions to semiconductor packaging technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of electronic components.