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For the Inventor, By the Inventor

Hwaseong-si, South Korea

Hyuekjae Lee

USPTO Granted Patents = 25 

Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Hwasung, KR (2013)
  • Suwon-si, KR (2013)
  • Hwaseong-si, KR (2021 - 2024)

Company Filing History:

goldMedal25 out of 131,766 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2013-2025

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25 patents (USPTO):Explore Patents
1. 12512428 - Semiconductor device and method of fabricating the same (2025-12-30),
2. 12438064 - Semiconductor package with bonding interface (2025-10-07),
3. 12261164 - Semiconductor package (2025-03-25),
4. 12237308 - Semiconductor package (2025-02-25),
5. 12132019 - Packaged multi-chip semiconductor devices and methods of fabricating same (2024-10-29),
6. 12040313 - Semiconductor package and a method for manufacturing the same (2024-07-16),
7. 11984421 - Integrated circuit chip having BS-PDN structure (2024-05-14),
8. 11955449 - Stacked semiconductor package (2024-04-09),
9. 11901336 - Semiconductor package (2024-02-13),
10. 11798929 - Semiconductor package (2023-10-24),
11. 11764192 - Semiconductor package including underfill material layer and method of forming the same (2023-09-19),
12. 11721673 - Semiconductor package having stacked semiconductor chips (2023-08-08),
13. 11694996 - Semiconductor package including a pad contacting a via (2023-07-04),
14. 11676925 - Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the same (2023-06-13),
15. 11658148 - Semiconductor package and a method for manufacturing the same (2023-05-23),

Title: Hyuekjae Lee: Innovator in Semiconductor Technology

Introduction

Hyuekjae Lee is a prominent inventor based in Hwaseong-si, South Korea, recognized for his significant contributions to the field of semiconductor technology. With a remarkable portfolio consisting of 22 patents, Lee has been instrumental in advancing the capabilities and efficiency of semiconductor packaging.

Latest Patents

Hyuekjae Lee’s latest patents showcase groundbreaking advancements in semiconductor packaging design. One of his notable inventions is a semiconductor package that integrates multiple semiconductor chips with distinct wiring structures. This innovative design includes a first semiconductor chip featuring a wiring layer and through vias for power connectivity, enabling a more efficient power distribution mechanism. Additionally, Lee has developed a package for multi-chip semiconductor devices, which involves a detailed architecture that ensures optimal bonding and insulation between chips, enhancing overall device performance and reliability.

Career Highlights

Lee's career is marked by his significant role at Samsung Electronics Co., Ltd., where he has made substantial contributions to research and development in semiconductor technology. His work continually pushes the boundaries of what is possible in semiconductor packaging, making devices smaller, faster, and more efficient.

Collaborations

In his innovative journey, Hyuekjae Lee has collaborated with esteemed colleagues, including Taehun Kim and Jihwan Hwang. Their collective expertise and teamwork have been pivotal in transforming conceptual ideas into patentable inventions, reflecting a strong synergy that drives innovation at Samsung.

Conclusion

Hyuekjae Lee’s contributions to the field of semiconductor technology underscore his status as a leading inventor. His 22 patents highlight a commitment to innovation that not only advances the capabilities of modern electronics but also sets a foundation for the future development of semiconductor applications. Through collaboration and creativity, Lee continues to influence the industry and inspire future inventors.

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