Hyeong Mook Kim

Title: Hyeong Mook Kim: Innovator in CMP Slurry Composition

Introduction

Hyeong Mook Kim is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of chemical mechanical polishing (CMP) through his innovative patents. His work primarily focuses on the development of slurry compositions for polishing tungsten and copper films.

Latest Patents

Hyeong Mook Kim holds 2 patents that showcase his expertise in CMP slurry compositions. His latest patents include a CMP slurry composition for polishing tungsten pattern wafers and a method of polishing tungsten pattern wafers using the same. This CMP slurry composition consists of a solvent, which can be either a polar or non-polar solvent, an abrasive agent, and a biocide. The abrasive agent is specifically designed to include silica modified with a silane containing either two or three nitrogen atoms. Additionally, the biocide comprises a compound of a specific formula. Another significant patent involves a CMP slurry composition for copper films and a method of polishing copper films using the same. This composition also includes a polar or non-polar solvent and polishing particles modified with a silicon-containing compound.

Career Highlights

Hyeong Mook Kim is currently associated with Samsung SDI Co., Inc., where he continues to innovate in the field of CMP technologies. His work has been instrumental in advancing the efficiency and effectiveness of polishing processes in semiconductor manufacturing.

Collaborations

Hyeong Mook Kim has collaborated with notable colleagues, including Jong Won Lee and Eui Rang Lee. These collaborations have further enriched his research and development efforts in CMP slurry compositions.

Conclusion

Hyeong Mook Kim is a distinguished inventor whose contributions to CMP slurry compositions have significantly impacted the semiconductor industry. His innovative patents reflect his commitment to advancing technology in this critical field.