The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Oct. 16, 2020
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Hyeong Mook Kim, Suwon-si, KR;
Keun Sam Jang, Suwon-si, KR;
Dong Hun Kang, Suwon-si, KR;
Jong Won Lee, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 13/06 (2006.01); C23F 3/00 (2006.01); H01L 21/321 (2006.01); C01B 33/12 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 13/06 (2013.01); C23F 3/00 (2013.01); H01L 21/3212 (2013.01); C01B 33/12 (2013.01);
Abstract
A CMP slurry composition for copper films and a method of polishing a copper film using the same are disclosed, the composition including a polar solvent or a non-polar solvent; and polishing particles modified with a silicon-containing compound, wherein the silicon-containing compound is represented by Formula 1,