The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Jul. 19, 2021
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Eui Rang Lee, Suwon-si, KR;
Yoon Young Koo, Suwon-si, KR;
Won Jung Kim, Suwon-si, KR;
Hyeong Mook Kim, Suwon-si, KR;
Tae Won Park, Suwon-si, KR;
Jong Won Lee, Suwon-si, KR;
Youn Jin Cho, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); A01N 33/20 (2006.01); A01N 37/34 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); A01N 33/20 (2013.01); A01N 37/34 (2013.01); H01L 21/3212 (2013.01);
Abstract
A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the CMP slurry composition including a solvent, the solvent being a polar solvent or a non-polar solvent; an abrasive agent; and a biocide, wherein the abrasive agent includes silica modified with a silane containing two nitrogen atoms or silica modified with a silane containing three nitrogen atoms, the biocide includes a compound of Formula 3: