Eui Rang Lee

Title: Eui Rang Lee: Innovator in CMP Slurry Composition

Introduction

Eui Rang Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of chemical mechanical polishing (CMP) through his innovative patents. With a total of 2 patents, Lee has focused on enhancing the efficiency and effectiveness of tungsten pattern wafer polishing.

Latest Patents

Lee's latest patents include a CMP slurry composition for polishing tungsten pattern wafers and a method of polishing tungsten pattern wafers using the same. The CMP slurry composition features a solvent, which can be either a polar or non-polar solvent, an abrasive agent, and a biocide. The abrasive agent consists of silica modified with a silane containing two or three nitrogen atoms. Additionally, the biocide includes a specific compound that enhances the polishing process. Another patent details a similar CMP slurry composition, but it incorporates an oxidizing agent along with the abrasive agent, which is modified with an amino silane that contains three nitrogen atoms.

Career Highlights

Eui Rang Lee is currently employed at Samsung SDI Co., Inc., where he continues to develop innovative solutions in the field of semiconductor manufacturing. His work has been instrumental in advancing the technology used in wafer polishing, which is critical for the production of high-performance electronic devices.

Collaborations

Lee has collaborated with several talented individuals in his field, including Yoon Young Koo and Won Jung Kim. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Eui Rang Lee's contributions to CMP slurry compositions have positioned him as a key figure in the semiconductor industry. His innovative patents reflect his commitment to improving manufacturing processes and enhancing product quality.