The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Sep. 20, 2021
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, KR;
Inventors:
Won Jung Kim, Suwon-si, KR;
Yoon Young Koo, Suwon-si, KR;
Hyeong Mook Kim, Suwon-si, KR;
Tae Won Park, Suwon-si, KR;
Eui Rang Lee, Suwon-si, KR;
Jong Won Lee, Suwon-si, KR;
Youn Jin Cho, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1454 (2013.01); H01L 21/304 (2013.01);
Abstract
A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition including a solvent; and an abrasive agent, wherein the abrasive agent includes silica modified with polyethyleneimine-derived aminosilane, and the composition has a pH of about 4 to about 7.