Tae Won Park

Title: The Innovations of Tae Won Park

Introduction

Tae Won Park is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor manufacturing, particularly in the development of chemical mechanical polishing (CMP) technologies. With a total of 2 patents to his name, Park continues to push the boundaries of innovation in his industry.

Latest Patents

Tae Won Park's latest patents include a CMP slurry composition for polishing tungsten pattern wafers and a method of polishing tungsten pattern wafers using the same. The first patent describes a CMP slurry composition that includes a solvent, which can be either a polar or non-polar solvent, an abrasive agent, and a biocide. The abrasive agent is specifically noted to include silica modified with a silane containing two or three nitrogen atoms. The second patent also focuses on a CMP slurry composition for polishing tungsten pattern wafers, detailing a composition that includes a solvent, an abrasive agent, and an oxidizing agent. In this case, the abrasive agent is silica modified with an amino silane that contains three nitrogen atoms.

Career Highlights

Tae Won Park is currently employed at Samsung SDI Co., Inc., where he applies his expertise in semiconductor technologies. His work has been instrumental in enhancing the efficiency and effectiveness of wafer polishing processes, which are critical in the production of high-performance electronic devices.

Collaborations

Throughout his career, Park has collaborated with talented individuals such as Eui Rang Lee and Yoon Young Koo. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Tae Won Park is a distinguished inventor whose work in CMP technologies has made a significant impact on the semiconductor industry. His innovative patents and collaborations with fellow professionals highlight his commitment to advancing technology.