logo

For the Inventor, By the Inventor

Taipei, Taiwan

Hung-Yu Chou

USPTO Granted Patents = 12

Average Co-Inventor Count = 4.9

ph-index = 1


Company Filing History:

goldMedal12 out of 29,312 
 
Texas Instruments Corporation
 patents

Years Active: 2019-2024

Loading Chart...
12 patents (USPTO):Explore Patents
1. 12040197 - Mechanical couplings designed to resolve process constraints (2024-07-16),
2. 11973052 - Stud bump for wirebonding high voltage isolation barrier connection (2024-04-30),
3. 11948721 - Packaged isolation barrier with integrated magnetics (2024-04-02),
4. 11942448 - Integrated circuit die pad cavity (2024-03-26),
5. 11862538 - Semiconductor die mounted in a recess of die pad (2024-01-02),
6. 11848297 - Semiconductor device packages with high angle wire bonding and non-gold bond wires (2023-12-19),
7. 11742265 - Exposed heat-generating devices (2023-08-29),
8. 11735506 - Packages with multiple exposed pads (2023-08-22),
9. 11421981 - Single wavelength reflection for leadframe brightness measurement (2022-08-23),
10. 10861777 - Wire bond clamp design and lead frame capable of engaging with same (2020-12-08),
11. 10429174 - Single wavelength reflection for leadframe brightness measurement (2019-10-01),
12. 10340152 - Mechanical couplings designed to resolve process constraints (2019-07-02),

Title: Innovations of Inventor Hung-Yu Chou

Introduction

Hung-Yu Chou is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, holding a total of 12 patents. His work primarily focuses on mechanical couplings and electronic device design, showcasing his expertise in innovative solutions.

Latest Patents

Among his latest patents is a design for mechanical couplings aimed at resolving process constraints. This invention features an integrated circuit package that includes a shunt resistor with at least one self-aligning member protruding from a first surface. Additionally, it incorporates a lead frame with a self-aligning feature that is a cavity, accommodating the self-aligning member, along with an integrated circuit positioned on the lead frame. Another notable patent is for a stud bump designed for wirebonding high voltage isolation barrier connections. This electronic device includes a bond wire with a first end bonded by a ball bond to a planar side of a first conductive plate, and a second end bonded by a stitch bond to a conductive stud bump at an angle greater than or equal to 60 degrees. The wirebonding method described in this patent involves forming a ball bond to join the first end of the conductive bond wire to the first conductive plate and forming a stitch bond to connect the second end to the conductive stud bump.

Career Highlights

Hung-Yu Chou is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His work has significantly impacted the electronics industry, particularly in the areas of circuit design and mechanical coupling solutions.

Collaborations

He has collaborated with notable coworkers, including Yuh-Harng Chien and Bo-Hsun Pan, contributing to various projects and advancements in their field.

Conclusion

Hung-Yu Chou's contributions to electronics through his patents and innovative designs highlight his role as a leading inventor in the industry. His work continues to influence the development of advanced electronic devices and solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…