The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Oct. 22, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Hung-Yu Chou, Taipei, TW;
Chi-Chen Chien, New Taipei, TW;
Yuh-Harng Chien, New Taipei, TW;
Steven Alfred Kummerl, Carrollton, TX (US);
Bo-Hsun Pan, Taoyuan, TW;
Fu-Hua Yu, New Taipei, TW;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4839 (2013.01); H01L 21/565 (2013.01); H01L 23/3157 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01); H01L 23/5228 (2013.01);
Abstract
In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.